DSB Co., Ltd. announced a private placement of 110,000 shares of its treasury common stock at a price of ¥646 per share for gross proceeds of ¥71,060,000 on April 20, 2018. The transaction included participation from CAREERLINK Co., Ltd. (TSE:6070). The company announced that it will incur issue expenses of ¥250,000 in the transaction.
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|
5-day change | 1st Jan Change | ||
2,484 JPY | -0.36% | +1.39% | +5.43% |
2023 | Careerlink Co., Ltd. Reports Earnings Results for the Full Year Ended March 31, 2023 | CI |
2021 | Careerlink Co., Ltd.(TSE:6070) added to S&P Global BMI Index | CI |
Annual profits - Rate of surprise
1st Jan change | Capi. | |
---|---|---|
+5.43% | 193M | |
+14.61% | 68.85B | |
-14.97% | 5.11B | |
+1.98% | 2.24B | |
-29.29% | 1.83B | |
+3.63% | 1.48B | |
+0.46% | 1.44B | |
-29.73% | 1.16B | |
-17.07% | 1.11B | |
+33.59% | 848M |
- Stock Market
- Equities
- 6070 Stock
- News Careerlink Co., Ltd.
- DSB Co., Ltd. announced that it has received ¥71.06 million in funding from CAREERLINK Co., Ltd.