Tongmen Technology (Beijing) Co., Ltd. announced that it will receive CNY 50 million in an equity round of funding on October 26, 2023. The transaction will include participation from returning investor Beijing Deep Glint Technology Co., Ltd. to retain the majority stake in the company. Post-completion of the transaction the registered capital of the company will be increased from CNY 21.428572 million to CNY 71.428572 million.

This has been approved in the first board of directors and the 14th meeting of the first board of supervisors.