Ultra Clean Holdings, Inc. Reports Earnings Results for the Fourth Quarter and Full Year Ended December 29, 2023
February 21, 2024 at 04:05 pm EST
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Ultra Clean Holdings, Inc. reported earnings results for the fourth quarter and full year ended December 29, 2023. For the fourth quarter, the company reported revenue was USD 444.8 million compared to USD 566.4 million a year ago. Net loss was USD 3.8 million compared to net income of USD 27.8 million a year ago. Basic loss per share from continuing operations was USD 0.08 compared to basic earnings per share from continuing operations of USD 0.61 a year ago. Diluted loss per share from continuing operations was USD 0.08 compared to diluted earnings per share from continuing operations of USD 0.61 a year ago.
For the full year, revenue was USD 1,734.5 million compared to USD 2,374.3 million a year ago. Net loss was USD 31.1 million compared to net income of USD 40.4 million a year ago. Basic loss per share from continuing operations was USD 0.7 compared to basic earnings per share from continuing operations of USD 0.89 a year ago. Diluted loss per share from continuing operations was USD 0.7 compared to diluted earnings per share from continuing operations of USD 0.88 a year ago.
Ultra Clean Holdings, Inc. is a developer and supplier of critical subsystems, components, parts, and ultra-high purity cleaning and analytical services, primarily for the semiconductor industry. It offers its customers an integrated outsourced solution for major subassemblies, design-to-delivery cycle times, design for manufacturability, and prototyping. The Companyâs segments are Products and Services. The Products segment primarily designs, engineers, and manufactures production tools, components, parts, and modules and subsystems. The Products segment includes chemical delivery modules, frame assemblies, gas delivery systems, fluid delivery systems, precision robotics and process modules as well as other high-level assemblies. The Services segment provides ultra-high purity parts cleaning, process tool part recoating, surface encapsulation and high sensitivity micro contamination analysis primarily for the semiconductor device makers and wafer fabrication equipment (WFE) markets.