Sondrel announced that it has successfully completed the tapeout, the next key milestone, including the associated invoicing, in respect of the material turnkey ASIC engagement for a Tier 1 OEM Automotive customer (the Project). Tapeout signals the completion of the design phase of an ASIC and the handover of all data to the silicon foundry which is contracted to manufacture the ASIC. This tapeout data is used to initiate the generation of photomasks by the foundry, which are then used to produce prototype silicon wafers.

These wafers are then packaged and tested before delivery to the customer for prototype assessment. With the design phase of the Project now achieved and its tapeout completed, the Company will progress with the new product introduction and prototyping phases of the turnkey supply services being provided to the customer.