HANMI Semiconductor : showcases ‘TC BONDER GRIFFIN’ for next g..
September 18, 2023 at 09:51 pm EDT
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HANMI Semiconductor showcases 'TC BONDER GRIFFIN' for next generation HBM
HANMI Semiconductor, a semiconductor equipment company, has introduced next-generation high- bandwidth memory (HBM) that is installed in artificial intelligence (AI) semiconductors.
According to HANMI Semiconductor on the 19th, the third- generation hyper model 'DUAL TC BONDER GRIFFIN' is released and will be delivered to global semiconductor company.
DS Kwak, vice chairman of HANMI Semiconductor, said, "The equipment introduced this time is a 3rd-generation hyper model of bonding equipment that stacks semiconductor chips manufactured by the 'TSV' method on wafers with the latest technology."
He added, "It is characterized by a significant improvement in productivity and precision for stacking semiconductor chips for next-generation HBM production." Also, "DUAL TC BONDER will greatly contribute to next year's sales, focusing on hyper model 'GRIFFIN' and premium model 'DRAGON'."
Vice chairman DS Kwak has invested a total of KRW 12.4 billion since July to purchase 232,300 additional shares of the company, increasing his stake to 35.75%. An official from HANMI Semiconductor explained, "The growth of the artificial intelligence (AI) market and the continuous launching series of equipment for HBM show confidence in the future performance of HANMI Semiconductor."
HANMI Semiconductor has applied for a total of 106 patents for bonding equipment (including scheduled applications). Based on this, it plans to gain the upper hand with its state of the art technology and durability and further increase its competitiveness in equipment.
HANMI Semiconductor Co. Ltd. published this content on 19 September 2023 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 19 September 2023 01:50:06 UTC.
Hanmi Semicondu-ctor Co., Ltd. is a Korea-based company mainly engaged in the manufacture of semiconductor equipment. The Company operates in two business segments: equipment segment and imported automobile segment. Its equipment segment manufactures semiconductor equipment, including sawing and placement systems, cam press trim/form/singulation systems, and pick and place systems, among others; photovoltaic (PV) equipment, including PV wafer production systems and PV cell production systems; light emitting diode (LED) equipment, including vision inspection systems, die bonding systems and others, as well as semiconductor molding products and equipment supplies. Its imported automobile segment engages in the dealing and maintenance of imported automobiles under the brand name of BMW.
HANMI SEMICONDUCTOR CO., LTD. 
