ChengDu Hi-Tech Development Co., Ltd announced a private placement of convertible bonds to raise up to CNY 730 million on August 15, 2022.
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5-day change | 1st Jan Change | ||
44.88 CNY | -2.94% | -12.55% | -9.66% |
Annual profits - Rate of surprise
1st Jan change | Capi. | |
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-9.66% | 2.18B | |
-1.17% | 56.2B | |
+27.86% | 40.39B | |
+16.01% | 32.04B | |
+10.84% | 28.92B | |
+16.73% | 21.13B | |
+12.60% | 19.02B | |
+75.53% | 17.77B | |
+39.37% | 17.37B | |
+13.27% | 15.15B |
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- News ChengDu Hi-Tech Development Co., Ltd.
- ChengDu Hi-Tech Development Co., Ltd. announced that it expects to receive CNY 730 million in funding