AEM Holdings Ltd. announced that its next-generation Automated Burn-In (ABI) test system has been selected as the Plan-of-Record solution by a major fabless provider of high-performance compute (HPC) and artificial intelligence (AI) semiconductor chips. The systems are intended for high-volume manufacturing (HVM) to address the emerging test needs for the customer's new device roadmap and will commence delivery in fiscal 2024, with further deliveries expected in the following years. A key factor in what AEM's ABI offers is the lower cost-of-test for HVM Burn-In.

The fully automated operation and high parallelism allow efficient testing and stress of high-power semiconductor devices such as AI processors, or other integrated circuits, which can significantly increase the throughput and efficiency of the testing process. These systems are designed to test products by subjecting them to extended periods of operation under stressful conditions, typically to detect potential defects or weaknesses before they reach the end consumer. AEM's ABI test solution also offers: Individual device control for test and thermal control, with advanced active thermal control at burn-in for devices requiring high power as seen in the latest generation roadmap HPC and AI devices.

Large form factor device handling with world leading safety features. Powerful software to accelerate the process of bringing a device to HVM. AEM's Test 2.0 paradigm is at the forefront of test solutions for next-generation advanced logic devices, including high-performance compute and AI.

AEM leads the industry in Active Thermal Control, Advanced Factory Automation, and Test Instrumentation.