Everspin Technologies, Inc. Announces Executive Changes
June 09, 2020 at 04:08 pm EDT
Share
Everspin Technologies, Inc. announced that on June 5, 2020, the company and Daniel Berenbaum entered into an offer letter pursuant to which Mr. Berenbaum will become Everspin’s principal financial and accounting officer, effective July 15, 2020. As a result, concurrent with Mr. Berenbaum assuming these roles, Matthew Tenorio, Everspin’s principal financial and accounting officer, will cease to function in these roles and resume his role as Everspin’s Corporate Controller. Mr. Berenbaum joins Everspin from GLOBALFOUNDRIES where he held various executive positions from May 2013 to June 2020. Most recently, from April 2018 to June 2020, he was Vice President, Finance and Chief Financial Officer, Asia/Pacific, responsible for manufacturing controlling, accounting, and shared services, as well as driving M&A for the region. Mr. Berenbaum’s previous roles at GLOBALFOUNDRIES include: Chief of Staff, Office of the CEO, from August 2017 to April 2018, in which position he helped to set priorities for the organization, and assisted the senior leadership team in driving timely and optimized business decisions; Head, Global Capital Procurement, from August 2016 to August 2017, in which role he was responsible for GLOBALFOUNDRIES’ multi-billion dollar annual capital spending and maintenance budget across five major sites; and Senior Director, Finance from May 2013 to August 2016, in which role he was responsible for the financial performance of GLOBALFOUNDRIES’ Singapore manufacturing operations.
Everspin Technologies, Inc. is engaged in providing magneto resistive random-access memory (MRAM) solutions. The Company's MRAM solutions offer non-volatile memory with the speed and endurance of random-access memory (RAM) and enable the protection of mission-critical data, particularly in the event of a power interruption or failure. Its portfolio of MRAM technologies includes Toggle MRAM and Spin-transfer Torque MRAM (STT-MRAM). Toggle MRAM products include industry standard interfaces, including Parallel, Serial Peripheral Interface (SPI) and Quad SPI (QSPI) interfaces. Its STT-MRAM technology delivers products in dynamic random-access memory (DRAM), SRAM and NOR Flash applications. It offers its products with DDR3 and DDR4 derivative interfaces, facilitating the replacement of battery-backed DRAM with STT-MRAM. Its 3D Tunnel Magneto Resistance (TMR) sensors provide high magnetic sensitivity in a single component that performs 3D magnetic field measurements in a monolithic solution.