(Company Registration No: 200705552D)
Unless otherwise defined, capitalised terms herein shall bear the same meaning ascribed to them under the Company's announcements released on 20 June 2013 and 6 July 2013 (collectively, the "Announcements").
Further to the Announcements, the Board of Directors of the Company is pleased to announce the completion of the Proposed Bond and Warrant Issue on 8 July 2013, with the issuance of the Bonds and Warrants by the Company to the Subscriber on 24 June 2013 and 8 July 2013, respectively.
The Company will make further announcements in relation to the Proposed Bond and Warrant Issue at the relevant time, including upon any redemption of the Bonds and/or exercise of the Warrants and in compliance with the requirements of the Listing Manual and the AIP granted by the SGX-ST on 5
July 2013.
The AIP granted by SGX-ST is not to be taken as an indication of the merits of the Proposed Bond and Warrant Issue, the New Shares, the Company and/or its subsidiaries.
Lin Jiancheng
Executive Chairman and CEO
8 July 2013
distributed by |