Announcement of the convening the 2022 Annual General
Shareholders' Meeting resolved by Board of Directors.
Date of events
2022/02/24
To which item it meets
paragraph 17
Statement
1.Date of the board of directors resolution:2022/02/24
2.General shareholders' meeting date:2022/05/26
3.General shareholders' meeting location:
No. 773, Ming-Hu Road, Hsinchu.
Lakeshore Hotel.
4.Cause for convening the meeting I.Reported matters:
(i) To report the business of 2021.
(ii) The Audit Committee's review report.
(iii)To report the compensations of employees and directors of 2021.
5.Cause for convening the meeting II.Acknowledged matters:
(i) To Ratify 2021 Business Report and audited financial statements.
(ii)To Ratify the proposal for distribution of 2021 profits.
6.Cause for convening the meeting III.Matters for Discussion:
(i)To approve the amendments to the Company's Operation Procedures
for Acquisition and Disposal of Assets.
7.Cause for convening the meeting IV.Election matters:None.
8.Cause for convening the meeting V.Other Proposals:None.
9.Cause for convening the meeting VI.Extemporary Motions:None.
10.Book closure starting date:2022/03/28
11.Book closure ending date:2022/05/26
12.Whether to announce proposal for profit distribution
or loss off-setting in "Status of dividend distribution
" section of MOPS:Yes.
13.Please explain the reason for not announcing proposal
for profit distribution or loss off-setting:None.
14.Any other matters that need to be specified:
Chairman may hold certain and/or all votes of such proposals until
the timing designated by the Chairman before the end of all agenda
hereunder.
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Ardentec Corporation published this content on 24 February 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 24 February 2022 09:41:05 UTC.
Ardentec Corporation is a Taiwan-based company principally engaged in the provision of wafer testing and product testing services. The Company provides memory integrated circuits (IC) testing, digital signal IC and mixed signal IC testing, wafer burn-in testing, laser repairing and trimming, embedded IC testing, liquid crystal display (LCD) drive IC testing, analog IC testing, radio frequency (RF) IC testing, as well as wafer testing technology development and product analysis services. The Company mainly conducts its businesses in the United States, Taiwan, Singapore and Mainland China.