Global CMP Equipment Market 2017-2021: Analysis By Wafer Size & End User - Research and Markets
The "Global CMP Equipment Market 2017-2021" report has been added to Research and Markets' offering.
The global CMP equipment market is forecast to grow at a CAGR of 6.71% during the period 2017-2021.
The report, Global CMP Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
The latest trend gaining momentum in the market is the use of NEMS. NEMS are devices that integrate electrical and mechanical systems at a nanoscale. They are the logical next-generation devices after MEMS. They have a large number of features, such as low power consumption and production costs because of their small size. NEMS are less than 100nm in diameter but have a large surface area. This makes them useful for devices, such as high-frequency resonators and ultrasensitive sensors. NEMS can be used in a number of devices that include accelerometers, drug delivery systems, energy harvesters, gyroscopes, and portable power generators.
According to the report, one of the major drivers for this market is the rising number of fabs. Semiconductor fabs are fabrication plants that manufacture ICs. These ICs are either designed in-house by IDMs or manufactured by pureplay foundries as per the designs provided by clients. Owing to the increasing application of semiconductor components in various emerging technologies, such as IoT and AI, the need for silicon wafers to manufacture these components is rising. This is leading to the increased need to construct more fabs. Many companies are building new fabs as the semiconductor foundry market is highly competitive. The race for the introduction of new technologies is also a factor that is driving the construction of new fabs.
- Applied Materials
Other prominent vendors
- TOKYO SEIMITSU
Key Topics Covered:
Part 01: Executive Summary
Part 02: Scope Of The Report
Part 03: Research Methodology
Part 04: Introduction
Part 05: Market Landscape
Part 06: Market Segmentation By Wafer Size
Part 07: Market Segmentation By End-User
Part 08: Geographical Segmentation
Part 09: Key Leading Countries
Part 10: Decision Framework
Part 11: Drivers And Challenges
Part 12: Market Trends
Part 13: Vendor Landscape
Part 14: Key Vendor Analysis
Part 15: Appendix
For more information about this report visit https://www.researchandmarkets.com/research/xkzjzr/global_cmp