Micro-Mechanics (Holdings) Ltd. Stock

Equities

5DD

SG1O09910991

Semiconductor Equipment & Testing

Delayed Singapore S.E. 04:01:25 2024-04-19 am EDT 5-day change 1st Jan Change
1.44 SGD -0.69% Intraday chart for Micro-Mechanics (Holdings) Ltd. -2.70% -25.39%
Sales 2022 82.46M 60.57M Sales 2023 67.02M 49.23M Capitalization 243M 179M
Net income 2022 19M 13.96M Net income 2023 9M 6.61M EV / Sales 2022 4.66 x
Net cash position 2022 18.76M 13.78M Net cash position 2023 12.07M 8.87M EV / Sales 2023 3.45 x
P/E ratio 2022
20.4 x
P/E ratio 2023
24.9 x
Employees 495
Yield 2022
4.14%
Yield 2023
5.14%
Free-Float 32.95%
More Fundamentals * Assessed data
Dynamic Chart
1 day-0.69%
1 week-2.70%
Current month+5.11%
1 month-0.69%
3 months-26.90%
6 months-21.74%
Current year-25.39%
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1 week
1.43
Extreme 1.43
1.48
1 month
1.37
Extreme 1.37
1.53
Current year
1.37
Extreme 1.37
2.03
1 year
1.37
Extreme 1.37
2.12
3 years
1.37
Extreme 1.37
3.45
5 years
1.32
Extreme 1.32
4.03
10 years
0.52
Extreme 0.515
4.03
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Managers TitleAgeSince
Founder - 82-12-31
Director of Finance/CFO 56 01-01-31
Director/Board Member - 22-12-31
Members of the board TitleAgeSince
Founder - 82-12-31
Director/Board Member 58 14-05-31
Chairman - 03-05-15
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Date Price Change Volume
24-04-19 1.44 -0.69% 10 600
24-04-18 1.45 +1.40% 16,000
24-04-16 1.43 -2.72% 12,200
24-04-15 1.47 -0.68% 16,100
24-04-12 1.48 +2.07% 4,200

Delayed Quote Singapore S.E., April 19, 2024 at 04:01 am EDT

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Micro-Mechanics (Holdings) Ltd. is a Singapore-based integrated mechanics solution company. The Company is engaged in the business of designing, manufacturing, and marketing high precision tools and parts used in process-critical applications for the wafer-fabrication and assembly processes of the semiconductor industry. The Company is also engaged in the contract manufacturing of precision parts and tools used in process-critical applications for the semiconductor wafer-fabrication industry. The Company's segments include Singapore, Malaysia, the Philippines, the USA, and China. Its products and solutions include Semiconductor, which include Die Attach, Wire-bonding, and Encapsulation. Its Die Attach products include Rubber Tips (Integrated Circuits), High-Temp Plastic Tools, Tungsten Carbide Collets, Sensor Assembly (ASM), Vacuum Wand Tools, Dispensing Nozzle Adaptors, Epoxy Stamping Tools, Die Ejection, Wire Bonding, and Encapsulation, among others.
More about the company

Annual profits - Rate of surprise